The domains of Mixed Reality (MR), Augmented Reality (AR), and Virtual Reality (VR) have witnessed rapid advancements in recent years. These technologies have found extensive applications across various sectors, including entertainment, education, healthcare, and industrial settings. As these markets continue to experience significant growth, the escalating demands for processing prowess and advanced graphics rendering capabilities have underscored the critical importance of efficient heat dissipation. This is particularly relevant as devices are pushed to perform optimally while adhering to lightweight design constraints. The amalgamation of these technologies has resulted in substantial heat generation during intensive computational tasks and intricate image processing, thereby accentuating the challenge of effective thermal management.

JONES Graphite Heat Dissipation Solution

In response to the thermal challenges presented by MR/VR/AR devices, where sustained chip heat and lightweight design demands converge, JONES’ 6-70 series synthetic graphite would be an ideal and efficacious solution. Engineered with remarkable thermal conductivity exceeding 1000W/m·K, it emerges as a compelling solution for heat dissipation in MR/AR/VR devices. Within these devices, JONES’ graphite products rapidly channels heat from chips to components like frames, ensuring uniform distribution and significantly boosting overall heat dissipation efficiency. This integration leverages JONES’ expertise, forging an innovative thermal management solution for these dynamic technologies.

JONES 6-70 series synthetic graphite products is derived from Polyimide film through high-temperature graphitization at over 2000 degrees Celsius. Its orderly atomic arrangement forms a lattice structure, enabling a surface thermal conductivity exceeding 1200W/m·K. This effectively eliminates local heat hotspots, swiftly distributing heat across the surface and enhancing heat transfer efficiency by expanding the dissipation area.

Conventional heat dissipators employ metals like aluminum and copper, with thermal conductivities around 100-400W/m·K. JONES’ synthetic graphite heat dissipation solution ingeniously blends synthetic graphite with traditional metal dissipators, introducing a pioneering breakthrough in the realm of thermal management.

The Combination Comprises 3 Primary Methods

1. Bonding the graphite surface to the heat dissipator using PSA(pressure-sensitive adhesive). This method is straightforward, cost-effective, but PSA might restrict heat dissipation efficiency.
2. Employing thermal grease to fill the gap between the graphite and the dissipator. This method offers operational convenience and low thermal resistance but introduces some impact on cleanliness.
3. Copper-plating the graphite surface and welding it onto the heat dissipator. Despite its complexity, this method achieves the lowest thermal resistance.

As the MR, AR, and VR markets continue to evolve, the critical role of heat dissipation materials in ensuring device performance, user experience, and device reliability is increasingly evident. The efficacy of heat dissipation design and material selection stands as an essential factor for the successful application of these cutting-edge technologies. With over two decades of experience in the heat dissipation field, JONES has been dedicated to continuous innovation in thermal management solutions and Functional Polymer Material technology. Currently, JONES’ synthetic graphite films and innovative integration solutions with traditional metal heat dissipators have been successfully implemented in the first-generation MR devices of JONES’ major clients.

JONES provides a comprehensive thermal management solutions, encompassing Graphite materials, TIM materials, Heat pipes(HP), Vapor chambers(VC), Thermal module, Liquid cooling plates design and manufacturing. By delivering more efficient heat dissipation design and material choices to emerging markets, JONES drives substantial momentum into industry development and offer steadfast and reliable support.

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Charging piles have experienced rapid growth as a vital component of the new infrastructure strategy, supporting the widespread adoption of new energy vehicles. As part of this digital and intelligent transformation, charging piles are evolving towards high-power charging, energy interconnection, and orderly charging. Like modern-day “gas stations” for electric vehicles, charging piles face the challenge of meeting the demands of fast charging, resulting in increased heat generation from electronic components. JONES offers a dependable solution for heat conduction, sealing, and potting to address these challenges.

Charging piles employ various heat dissipation methods, including natural heat dissipation, forced air cooling, liquid cooling, and air conditioning. AC charging piles, which consist of a main control board housing heat-generating components like the main control and communication modules, primarily rely on natural heat dissipation. JONES tackles this by minimizing thermal resistance between the main control board and the aluminum shell using Thermal Interface Material (TIM). JONES offers different TIM options, such as Thermal Pad, Thermal Gel, Thermal Grease, and Phase Change Material (PCM), all of which exhibit low thermal resistance and excellent insulation properties. Furthermore, JONES also offers conformal coating solutions for PCB protection, featuring functions such as moisture resistance, insulation, and leak prevention, as well as customized CIPG or FIPG housing sealing solutions designed to match customer processes.

JONES provides a comprehensive solution to address the critical issues of heat dissipation and sealing in charging piles. As the demand for high-power charging and energy interconnection continues to grow, JONES remains dedicated to delivering reliable, high-quality products and outstanding customer service, contributing to the advancement of the new energy vehicle infrastructure.

Charging Pile Heat Conduction & Sealing Scheme

The reliability of charging cables, serving as the interface between the power source and the electric vehicle’s battery system, is crucial. These cables endure repeated insertions, removals, and mechanical collisions during gun head connections. To ensure robust performance, some gun heads are filled with thermally conductive potting glue for terminal fixation and wire connections. JONES offers cost-effective, high-performance potting adhesives that fully encapsulate cables and wires within charging connectors, ensuring long-lasting durability and reliability for high-voltage components.

Charging Gun Potting

JONES takes pride in its independently researched and developed thermal interface materials, EMI materials, and adhesives. From initial development and design to supply chain management, production, and delivery, JONES maintains a customer-centric approach throughout the entire process. This commitment ensures product quality and exceptional after-sales technical support, granting customers peace of mind.

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In the realm of composite materials, JONES’s Graphite over Foam (GOF) stands out as an innovation. This composite material design combines foam’s flexibility with graphite’s high thermal conductivity, all while offering cushioning. JONES‘s GOF can be single-sided or double-sided adhesive for improved bonding convenience, especially in scenarios marked by low power consumption, a demand for flexibility, and the requirement for significant compression space.

JONES’s Graphite Over Foam (GOF)

JONES’s Graphite Over Foam (GOF) can be molded into various shapes, making it ideal for applications on irregular or uneven device surfaces, and the foam core’s high compressibility and resilience ensure excellent surface contact. This allows it to effectively fill the air gaps between heating devices and heat sinks or metal casings, facilitating the efficient transfer of heat to the cooling mechanism. This, in turn, enhances device performance, reliability, and service life.

JONES’s Graphite Over Foam (GOF) offers the flexibility of customization to specific shapes or can be configured as a single-sided adhesive gasket. Installing and assembling this material is straightforward, and you can refer to the accompanying diagram for a clearer understanding of its structure.

Key Features and Advantages: Graphite over foam (GOF) boasts several outstanding features. Its excellent thermal conductivity efficiently dissipates heat, resulting in low thermal resistance. Despite its thermal properties, GOF maintains a low density and is incredibly lightweight. It exhibits high thermal stability and is easy to manipulate due to its flexibility, softness, and ease of installation. Moreover, it is compliant with RoHS standards.

Applications: Graphite over Foam is a versatile material suitable for various applications. It is commonly used in memory modules, mass storage devices, automotive electronics, telecommunications hardware, radios, power electronics, set-top boxes, audio and video players, and IT infrastructure. Its ability to manage heat efficiently and adapt to irregular surfaces makes it valuable across a wide range of industries.

For more insights into JONES product offerings, please get in touch with the JONES team. JONES is committed to catering to a wide range of application requirements, delivering outstanding solutions to our valued clients.

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