Thermal PAD 21-1500-200-1196, 45*45*2

JONES Thermal Pad 21-1500 is a soft and super high thermal conductive material. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.

JONES Thermal Pad 21-1500 is non-tacky pad and 21-1500A is single- nsided tacky pad, both of which are easy for handling and application.

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Thermal PAD 21-1500-100-1196, 45*45*1

JONES Thermal Pad 21-1500 is a soft and super high thermal conductive material. It is conformable to uneven and rough surfaces,
where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.

JONES Thermal Pad 21-1500 is non-tacky pad and 21-1500A is single- nsided tacky pad, both of which are easy for handling and application.

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Thermal PAD 21-881-250-0660 100*200*2.5

JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.

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Thermal PCM (piece);21-745-020-0132;100*100*0.2mm

JONES PCM 21-745, phase change interface thermal material, is designed to maximize heat sink performance and improve component reliability. It minimizes thermal resistance at interfaces and maintains excellent performance when it fills interfacial gaps and voids. At room temperature, JONES PCM 21-745 is solid and easy to handle. This allows it to be consistently and cleanly applied as dry pad to heat sink or component surface. Upon reaching its softening temperature of 50 °C, PCM 21-745 begins to soften and flow, filling the microscopic irregularities of the component. The result is an interface with minimal bond-line thickness and thermal contact resistance.

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Thermal PAD 21-881-150-0660 100*200*1.5

JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.

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Thermal PAD 21-881-100-0660 100*200*1

JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is
conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.

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Thermal PAD 21-869-250-0660 100*200*2.5

JONES Thermal Pad 21-869 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m-K.It is highly conformable to uneven and rough surfaces, where require the thermal gap filler material has a characteristics of over 50% compressibility.Its soft construction offers high conformability and effectively reduces thermal resistance.

JONES Thermal Pad 21-869 is natually tacky and 21-869A is single-side tacky, both of which facilitate easy handling and simplified application.

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Thermal PAD 21-869-200-0660 100*200*2

JONES Thermal Pad 21-869 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m-K.It is highly conformable to uneven and rough surfaces, where require the thermal gap filler material has a characteristics of over 50% compressibility.Its soft construction offers high conformability and effectively reduces thermal resistance.

JONES Thermal Pad 21-869 is natually tacky and 21-869A is single-side tacky, both of which facilitate easy handling and simplified application.

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Thermal PAD 21-869-150-0660 100*200*1.5

JONES Thermal Pad 21-869 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m-K.It is highly conformable to uneven and rough surfaces, where require the thermal gap filler material has a characteristics of over 50% compressibility.Its soft construction offers high conformability and effectively reduces thermal resistance.

JONES Thermal Pad 21-869 is natually tacky and 21-869A is single-side tacky, both of which facilitate easy handling and simplified application.

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Thermal PAD 21-869-100-0660 100*200*1

JONES Thermal Pad 21-869 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m-K.It is highly conformable to uneven and rough surfaces, where require the thermal gap filler material has a characteristics of over 50% compressibility.Its soft construction offers high conformability and effectively reduces thermal resistance.

JONES Thermal Pad 21-869 is natually tacky and 21-869A is single-side tacky, both of which facilitate easy handling and simplified application.

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